Flip chip MEMS microphone package with large acoustic reference volume
نویسندگان
چکیده
منابع مشابه
Design for Flip-Chip and Chip-Size Package Technology
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologies. This movement is occurring at all levels: at the IC, at the IC package, at the module, at the hybrid, the PC board which ties all the systems together. Interconnection density and methodology becomes ...
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A fully-dry, flip-chip fabrication technology was developed for the integration of high fill factor, silicon-on-insulator (SOI) structures and CMOS-MEMS actuators. An SOI mirror array with a fill factor of 95% and radius of curvature >1.3 m was fabricated on CMOS-MEMS electrothermal actuators using this technology. The unloaded actuators achieved an optical scan range of >92o. Following flip-ch...
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The lid of an ASIC package can significantly increase the temperature of the die by impeding heat transfer. In flip-chip packages the backside of a die can be exposed by eliminating the lid, thus allowing a heat sink to be attached directly. Numerical finite difference methods and experimentation were used to investigate the differences between lidded and lidless flip-chip designs. The results ...
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The rapid uptake of flip-chip technology within the electronics industry, is placing the reliability of such assemblies under increasing scrutiny. A key feature of the assembly process is the application of underfill to reinforce the attachment of the die to the printed circuit board. This has been identified in numerous studies as one of the major ways in which the reliability of the devices c...
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Polymer Thick Film (PTF) technology provides the lowest cost, cleanest and most efficient manufacturing method for producing flexible circuits. PTF is a 100% additive process capable of applying conductors, resistors and dielectrics directly to a substrate. SMD components can be assembled using low temperature process conductive adhesives making the PTF system compatible with the most temperatu...
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ژورنال
عنوان ژورنال: Procedia Engineering
سال: 2010
ISSN: 1877-7058
DOI: 10.1016/j.proeng.2010.09.121